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ProductsSoftware IPR

Software IPR

Azcom Technology provides carrier-grade LTE and HSPA+ Physical Layer software and LTE L2/L3 stack software for C-RAN and Small Cell deployments. Azcom also offers LTE UE protocol stack software – suitable for applications such as relay nodes, UE modems and multi-UE simulators.

LTE/HSPA+ Physical Layer software fully exploits Texas Instruments Keystone II System on Chip technology. Flexible design allows scalable multi-core deployment depending on performance and capacity requirements.

The modular software architecture, with support for industry recognized Small Cell Forum interfaces, ensures easy introduction of customer specific features and integration of another third party component. Software packages may also be delivered pre-integrated with Azcom Technology baseband board to reduce development time.

All Azcom software packages are extensively tested (including 3GPP conformance) for optimal performance and stability.

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LTE eNodeB PHY

Azcom Technology offers a carrier-grade LTE PHY software along with proprietary solutions in areas such advanced receivers. The LTE PHY software is end-to-end tested with SORBAS LTE Test-UE and commercial devices.
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LTE eNodeB Protocol Stack

Azcom Technology offers a highly optimized, 3GPP Rel.9 compliant LTE L2/L3 Protocol Stack with committed roadmap to Rel.10 and beyond. LTE Protocol Stack software is end-to-end tested with commercial LTE UEs and Evolved Packet Core (EPC)
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Evolved Packet Core (EPC)

The Evolved Packet Core (EPC) provides the new core network architecture for high-throughput, multi-service access. The all IP network, defined by 3GPP for LTE and other access technologies, features a simplified architecture for reduced latency
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HSPA+ NodeB PHY

Azcom Technology offers carrier grade HSPA+ PHY software, optimized for small cells and fully exploiting Texas Instruments Keystone II multi-core architecture and latest TMS320TCI66x digital signal processor (DSP) core.
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LTE UE Stack

Azcom Technology provides a full LTE UE protocol stack (Physical Layer, MAC, RLC, PDCP, RRC and NAS). The flexible design allows a broad-range of deployment scenarios such as Multi-UE simulators
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